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AS5013
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Operating Conditions on page 5 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Comments
Electrical Parameters
VDD
DC supply voltage
-0.3
5
V
VDDp
Peripheral supply voltage
-0.3
5
VDD +0.3
V
Vin
Input pin voltage
-0.3
VDDp +0.3
V
-
3.6
V
I
scr
Input current (latchup immunity)
-100
100
mA
Norm: JEDEC 78
Electrostatic Discharge
ESD
Electrostatic discharge
-
?
kV
Norm: MIL 883 E method 3015,
direct pad contact
?/DIV>
JA
Package thermal resistance
-
32
K/W
Velocity=0, Multi Layer PCB;
JEDEC Standard Testboard
Temperature Ranges and Storage Conditions
T
strg
Storage temperature
-55
125
癈
T
body
Package body temperature
260
癈
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020 Moisture/Reflow
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Humidity non-condensing
5
85
%
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